[{"data":1,"prerenderedAt":-1},["ShallowReactive",2],{"$f250tk9v6r0095":3},{"_id":4,"slug":5,"title":6,"subtitle":7,"kind":8,"cards":9,"tags":15,"categories":16,"source":17,"lang":20,"author":21,"audioState":20,"stats":24,"publishedAt":27,"renderer":28},"6abc607bca21c797c7e9ea9b","930800g16t-1ddd3b78","【中信证券：光模块温控正由“配套环节”升级为“性能决定环节”】金十数据9月30日讯，中信证券指出，随着800G光模块大规模放量、1.6T进入起量元年，单模块功耗与对温控精度的要求正在显著提高，光模块温控正由“配套环节”升级为“性能决定环节”…","书签 分享： 微信扫码分享 2026-09-30周三08:13:00 中信证券：光模块温控正由“配套环节”升级为“性能决定环节” 金十数据9月30日讯，中信证券指出，随着800G光模块大规模放量、1.6T进入起量元年，单模块功耗与对温控精度的要求正在显著提高，光模块温控正由“配套环节”升级为“性能决定环节”。光模块温控形成芯片级精准控温（Micro-TEC+陶瓷基板热沉）、界面导热（TIM凝胶\u002F石…","news",[10],{"headline":11,"body":12,"imageUrl":13,"images":14},"【中信证券：光模块温控正由“配套环节”升级为“性能决定环节”】金十数据9月30日讯，中信证券指出，随着800G光模块大规模放量、1.6T进入起量元年，单模块功耗…","书签 分享： 微信扫码分享 2026-09-30周三08:13:00 中信证券：光模块温控正由“配套环节”升级为“性能决定环节” 金十数据9月30日讯，中信证券指出，随着800G光模块大规模放量、1.6T进入起量元年，单模块功耗与对温控精度的要求正在显著提高，光模块温控正由“配套环节”升级为“性能决定环节”。光模块温控形成芯片级精准控温（Micro-TEC+陶瓷基板热沉）、界面导热（TIM凝胶\u002F石墨烯垫片）、模组级均热（VC均热板\u002F冷板）三层体系，单模块温控价值量随速率迭代系统性上移；叠加CPO\u002FNPO架构下光引擎与交换芯片同域散热，行业迎来量价齐升。竞争格局上，TEC、陶瓷基板等核心环节长期由日本厂商主导，国内厂商正加速突破，国产替代空间广阔。中信证券建议关注三条细分投资主线：TEC与陶瓷基板、TIM与石墨烯导热材料、VC均热板与液冷结构件。","\u002Fapi\u002Fmedia\u002Fposts\u002F930800g16t-1ddd3b78\u002F0.webp",{"local":13},[],[],{"name":18,"url":19},"Jin10","https:\u002F\u002Fflash.jin10.com\u002Fdetail\u002F20260930081300343800",null,{"handle":22,"displayName":23},"spots","Spots",{"views":25,"likes":26,"saves":26,"shares":26,"completions":26,"opens":26,"skips":26,"depthSum":26},1,0,"2026-09-30T01:06:03.957Z","local"]